InJet®

InJet® 388 TWIN CRD Sausage dog

InJet® 388 TWIN CRD Sausage dog

InJet® 388 TWIN CRD is primarily developed for removing solder pastes and SMT adhesives from stencils, PumpPrint, squeegee and misprint. The cleaning system can also be used for post-soldering plate cleaning or for a combination of plate cleaning and the above-mentioned cleaning processes. All processes are fully automated and take place in 2 process chambers, where the cleaning takes place in the first inlet chamber, after which the cleaned part is automatically transported by the medium transfer space to the 2 process chamber for rinsing and drying. This chamber is also an outlet chamber. Both chambers can be used in parallel, which increases machine capacity and reduces cross-contamination compared to single-chamber equipment.

Technical data sheet

InJet® 388 TWIN CRRD Sausage dog

InJet® 388 TWIN CRRD Sausage dog

InJet® 388 TWIN CRRD “Sausage Dog” is developed primarily for high-capacity and precise plate cleaning after soldering. The cleaning system can also be used for high-capacity removal of solder pastes and SMT adhesives from stencils, PumpPrint, squeegees and misprints. Cleaning takes place in the first inlet chamber, after which the cleaned part is automatically transported to the central passage chamber where the first rinsing process takes place. The last third and outlet chambers are for the final rinse and drying process. Both chambers (inlet and outlet) can be used simultaneously, which increases machine capacity and reduces cross-contamination compared to single-chamber systems.

Technical data sheet

InJet® 388 Triple CRRD

InJet® 388 Triple CRRD

InJet® 388 TRIPLE CRRD is developed primarily for high-capacity and precise plate cleaning after soldering. All processes are fully automated and run in 3 separate process chambers, where the cleaning takes place in the first inlet chamber, then the cleaned part is automatically transported to the central chamber where the first rinsing process takes place. The last third and outlet chambers are for the final rinse and drying process. All 3 chambers can be used in parallel, which increases machine capacity and reduces cross-contamination compared to single-chamber systems.

Technical data sheet

InJet® 3179 CRD BigBoard

InJet® 3179 CRD BigBoard

InJet® 3179 CRD is designed to remove solder pastes and SMT adhesives from non-standard oversized stencils up to 1170 x 2160 x 2015 mm and 46.1 x 85 x 79.3 in, respectively. The size of the process chamber also provides the possibility of inserting and simultaneously cleaning 2 standard 29 ”x 29” stencil. The InJet® 3179 CRD including 100% closed-loop withprocesses of cleaning, rinsing and drying technologies. All of the processes are fully automated, and take place in one process chamber.

Technical data sheet

InJet® 888 CRD 1F

InJet® 888 CRD 1F

InJet® 888 CRD-1F is designed primarily for removing flux residues from solder frames or for maintenance cleaning of soldering equipment parts. The designation 1F indicates a 1-storey solution, primarily intended for cleaning larger parts.

Technical data sheet

InJet® 888 CRRD 1F

InJet® 888 CRRD 1F

The InJet® 888 CRRD-1F is designed primarily to remove flux residues from PCB. The designation 1F indicates a 1-storey solution, primarily intended for cleaning larger parts. It is possible to insert and clean a stencil or misprints at the same time.

Technical data sheet

InJet® 888 CRD 2F

InJet® 888 CRD 2F

The InJet® 888 CRD-2F is developed primarily for the removal of smelting residues from soldering frames, and the maintenance cleaning of soldering equipment components. The cleaning system can be used for PCB cleaning, or for cleaning a combination of boards, misprints and stencils. It can also be used for cleaning of conformal coating frames. The cleaning system can be used for post-soldering board cleaning, or for cleaning a combination of boards, misprints and stencils. The 2F designation refers to a 2-storey solution where smaller parts can be cleaned in two baskets simultaneously to maximize cleaning capacity. After easy removal of the rotation arm, large parts can be cleaned in one (lower) basket.

Technical data sheet

InJet® 888 CRRD 2F

InJet® 888 CRRD 2F

The InJet® 888 CRRD-2F is designed primarily for removing flux residues from PCB. It is possible to insert and clean a stencil or misprints at the same time. The 2F designation refers to a 2-storey solution where smaller parts can be cleaned in two baskets simultaneously to maximize cleaning capacity. After easy removal of the rotation arm, large parts can be cleaned in one (lower) basket.

Technical data sheet

InJet® 388 CD

InJet® 388 CD

InJet® 388 CD is a basic cleaning solution to remove solder pastes from stencils, squeegees and one-sided misprint or can be used for PumpPrint cleaning after consultation.

Technical data sheet

InJet® 388 CRD

InJet® 388 CRD

InJet® 388 CRD is developed primarily for the removalof solder pastes and SMT adhesives from stencils, PumPrints,squeegees and misprints. The cleaning system can also be used for PCB cleaning, or for a combination of PCB cleaning and the afore-mentioned cleaning processes. The machine can also be used for the removal of cured conformal coating.

Technical data sheet

InJet® 388 CRRD Combo

InJet® 388 CRRD Combo

The InJet® 388 CRRD “Combo” is primarily designed for precision plate cleaning after soldering. The cleaning system can also be used for high-quality removal of solder pastes and SMT adhesives from stencils, PumpPrint, squeegees and misprint, or the aforementioned cleaning applications, along with cleaning the boards after soldering. It is also possible to use the machine to remove the cured conformal coating.

Technical data sheet

InJet® 388 Double Triple CRRD

InJet® 388 Double Triple CRRD

InJet® 388 DOUBLE TRIPLE CRRD delivers twice the cleaning capacity of the InJet® 388 TRIPLE CRRD and is, therefore, our most powerful vertical sprayer for post-solder plate cleaning, which has also been developed. The cleaning system can also be used for high-capacity removal of solder pastes and SMT adhesive from stencils, PumpPrint, squeegee and misprint. All processes are fully automated and run in 3 process chambers. Cleaning takes place in the first inlet chamber, after which the cleaned part is automatically transported to the central chamber where the first rinsing process takes place. The last third and outlet chambers are for the final rinse and drying process. All 3 chamber chambers (inlet and outlet) can be used simultaneously, which increases machine capacity and reduces cross-contamination compared to single-chamber equipment. The machine has two positions on the PCB frame (two slots), which means that at full capacity, 6 frames with PCB are simultaneously processed.

Technical data sheet

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