DCT combines the cleaning system, cleaning fluid and verified process settings for printing stencils, squeegees, PumPrints and PCB misprints. The right combination depends on the contaminant, the cleaned part, its materials and the required result.
DCT cleaning processes cover uncured solder paste and selected uncured SMT adhesives on printing stencils, squeegees, PumPrints and PCB misprints. Misprints with one soldered side require a different process from boards carrying uncured paste only.
The process is selected from the actual contaminant, component geometry, material compatibility and cleanliness requirement. A laboratory test with customer samples is the basis for recommending the machine, fluid and process window.
InJet systems use vertical high-pressure Spray-In-Air technology. Cleaning, rinsing and drying are automated; the appropriate configuration depends on part size, process separation and required capacity.
| System | Best starting point for | Process arrangement |
|---|---|---|
| InJet® 388 CRD | Standard stencils, squeegees, PumPrints and misprints | Cleaning, rinsing and drying in one process chamber |
| InJet® 388 TWIN CRD | Higher-capacity or separated cleaning and rinse/dry workflows | Cleaning in the first chamber; rinsing and drying in the second chamber |
| InJet® 3179 CRD “BigBoard” | Non-standard large stencils and standard stencils in a larger chamber | Automated cleaning, rinsing and drying in one process chamber |
Final equipment selection requires confirmation of part dimensions, holder design, contaminant and production capacity.
No single fluid should be selected from the application name alone. DCT matches the chemistry to the exact paste or adhesive and verifies material compatibility on representative samples.
| Application | Documented DCT options | Important distinction |
|---|---|---|
| Uncured solder paste on stencils, squeegees and misprints | Decotron® 250, Decotron® 250/25 or Decotron® 281 | Water-based options for high-pressure Spray-In-Air cleaning; the test determines the exact choice. |
| Difficult paste residues or redeposition on stencils | Decotron® 290 | Documented tests show that the actual paste, stencil surface and machine condition affect the result. |
| Misprints with one soldered side | Decotron® CP381 or Decotron® 355S | This is a combined uncured-paste and post-solder contamination case and needs a rinsing process. |
| Uncured SMT adhesive, or paste and adhesive in one process | Decotron® EFD1 | Compatibility and cleaning conditions must be tested for the exact adhesive and stencil construction. |
| Manual cleaning or pre-cleaning | Stencil Cleaner 11 | Used for manual cleaning or pre-cleaning of stencils and squeegees; follow the product safety information. |
DCT states that it takes 100% responsibility for the functionality of the cleaning process when the process uses the DCT cleaning system and DCT cleaning fluid selected for the application. The recommendation is established through application analysis and cleaning tests.
“Since the opening of our new facility, we added both the InJet® 388 for cleaning stencils and AirJet® 594 for washing reflow heat exchangers.”
Yes. InJet® 388 and InJet® 388 TWIN systems are documented for these applications. The holder, fluid and program must still be selected for the actual part and contaminant.
Sometimes. DCT documents combined processes with selected fluids, but the exact adhesive must be tested because unsuitable chemistry or temperature can change the adhesive and complicate cleaning.
It can. DCT tests have removed both fresh and aged residues, but contamination age and amount can change the required cleaning time and fluid selection.
No. Compatibility must include the stencil material, surface treatment, frame, bonding adhesive, labels and the complete cleaning, rinsing and drying process.
Rinsing removes cleaning-fluid and dissolved-contaminant residues when the selected chemistry requires it. The required rinse sequence is defined together with the fluid and cleanliness target.
Send the exact contaminant designation, sample parts, material restrictions and capacity requirement. DCT can then test the samples and recommend the machine, cleaning fluid and process settings.
A sample test provides the evidence needed to select the cleaning system, fluid, holder and process window for your production.
The records below are limited to this application. Process conditions and material compatibility must be confirmed for each production case.
| Contaminant / trade designation | Contaminant type | Application / cleaned part | Successfully used DCT fluid | Test note |
|---|---|---|---|---|
| AIM NC258 SAC305 T3/T4 | Unsoldered solder paste | Printing stencil | Decotron® 250 | Successfully removed in a DCT Spray-In-Air test. |
| ALMIT LFM-48W SUC-UI | Lead-free solder paste | Printing stencil | Decotron® CP381 | No residue observed under a microscope after the documented stencil cycle. |
| Alpha CVP-390 | Unsoldered solder paste | Printing stencil | Decotron® 250 | Residues were completely removed and the stencil was clean and spotless. |
| Alpha CVP 390, aged 16 hours | Raw solder paste | Stencil coupon, ultrasonic process | Decotron® 201 | Completely removed, including contamination in small apertures. |
| Alpha CVP 390 Innolot T5 | Raw solder paste and sticky residue | Printing stencil | Decotron® 290 | Fresh and aged residues were removed without visible residue in the apertures. |
| Alpha OM-325 | Raw solder paste | Printing stencil | Decotron® 250B | Complete removal in the documented agitated beaker test. |
| Alpha OM-338-PT | Unsoldered solder paste | Printing stencil | Decotron® 250/25 | Residues were completely removed in an InJet® 388 CRD test. |
| Alpha OM-338-PT, 1- and 20-hour dwell | Unsoldered solder paste | Printing stencil | Decotron® EFD1 | Fully removed in the documented InJet® 388 CRD test. |
| Alpha OM 340 | Raw solder paste | Misprinted PCB | Decotron® 290 | All paste residues were removed after immediate and delayed cleaning. |
| Alpha OM 340 | Raw solder paste | Printing stencil | Decotron® 290 | Stencils were successfully cleaned in the documented test. |
| Alpha OM 340 | Raw solder paste | Squeegee | Decotron® 290 | Successfully cleaned; the report notes that shape can require more time or a dedicated holder. |
| Alpha OM-340 | Accumulated solder paste | Squeegee side deflector | Decotron® EFD1 | Efficiently pre-cleaned in the documented air-bubbling test. |
| Alpha OM 340 Innolot | Solder paste and sticky residue | Printing stencil | Decotron® EFD1 | Paste was removed without redepositing the sticky contamination in the documented test. |
| Heraeus R8417 | Resistor paste | Printing stencil | Decotron® D250/20 | Successfully removed in the documented automatic cleaning test. |
| Indium 10.1 | Raw solder paste | Printing stencil | Decotron® 290 | Solder paste was successfully removed in the documented production trial. |
| Indium 5.8 | Raw solder paste | Printing stencil | Decotron® 290 | Solder paste was successfully removed in the documented production trial. |
| Indium 8.9HF | Raw solder paste | Frameless printing stencil | Decotron® 250 | The stencil was completely free of solder paste after the test. |
| Indium 8.9 HF, aged 16 hours | Raw solder paste | Stencil coupon, ultrasonic process | Decotron® 201 | Completely removed, including contamination in small apertures. |
| Indium 8.9 HF/TYPE 4 | Solder paste | Stencil, misprint and double-sided misprint | Decotron® 417XP | Residues were successfully removed with the documented process. |
| Indium SN62 NC-SMQ92J TYPE 3 | Solder paste | Stencil, misprint and double-sided misprint | Decotron® 417XP | Residues were successfully removed with the documented process. |
| Inventec Ecorel Free 305-7C | No-clean solder paste | Misprinted PCB | Decotron® CP381 | The documented test confirmed effective misprint removal. |
| KOKI S1XBIG58-M500-4 | Raw solder paste | Printing stencil | Decotron® EFD1 | Completely removed after the documented test for both 1- and 16-hour dwell times. |
| Koki GSP | Raw solder paste | Printing stencil | Decotron® 290 | Successfully removed in laboratory and cleaning-machine testing. |
| Koki S3X58-CF100-4 | Raw solder paste | Printing stencil | Decotron® 290 | Successfully removed in laboratory and cleaning-machine testing. |
| KOKI S3X58-M500 | Misprinted solder paste | PCB misprint | Proton® R09 | Successfully removed in the documented misprint test. |
| KOKI S3X58-M650-3 | Misprinted solder paste | PCB misprint | Decotron® CP381 | Completely removed in the documented three-minute cleaning step. |
| KOKI SB6NX58-M500SI | Misprinted solder paste | PCB misprint | Proton® R09 | Successfully removed in the documented misprint test. |
| KOKI SS48-M955 | Misprinted solder paste | PCB misprint | Decotron® CP381 | Completely removed in the documented misprint process. |
| KOKI SS48-M956-2 | Leaded solder paste | Printing stencil | Decotron® CP381 | No residue observed under a microscope after the documented stencil cycle. |
| Senju M31 GRN360-K1MK-V | Unsoldered solder paste | Squeegee | Proton® R09 | Effectively removed in the documented squeegee test. |
| Senju M705-ULT369 Type 5 | Unsoldered solder paste | Printing stencil | Decotron® CP381 | The stencil was fully clean after the documented test. |
| Tamura EL-QUEST-V2 | Raw solder paste | Stencil and squeegee | Decotron® 290 | Successfully removed; the documented tests addressed staining on low-surface-energy stencils. |
| Tamura TLF-286-GTS-VR1 | Raw solder paste | Printing stencil | Decotron® 250B | Complete removal in the documented test. |
| Alpatec AD 7212 | Adhesive | Printing stencil | Proton® 703 | Uncured adhesive was completely removed in the documented process. |
| Epibond 7275 | Uncured SMT adhesive | PumPrint / steel test coupon | Proton® R09 | Complete removal in the documented test; real-part compatibility still requires confirmation. |
| Heraeus Ag conductive adhesive PC 3002 | Uncured conductive adhesive | Printing stencil | Decotron® 250 or Proton® 69 | All stencil contamination was removed in the documented test. |
| Heraeus PD 955 PRM | Uncured SMT adhesive | Printing stencil | Decotron® EFD1 | All contamination was removed after the documented test for both 1- and 16-hour dwell times. |
| Heraeus PD 955 PRM | Uncured SMT adhesive | Printing stencil, alternate chemistry test | Decotron® 411A | All contamination was removed after the documented test for both 1- and 16-hour dwell times. |
| Heraeus PD 955 PY | Uncured SMT adhesive | Printing stencil, manual cleaning | Stencil Cleaner 11 | The adhesive dissolved successfully; the documented process does not require rinsing. |
| Loctite 3616 | Uncured SMT adhesive | Printing stencil | Decotron® EFD1 | Samples aged from 0 to 18 hours were successfully cleaned in the documented test. |
| ThreeBond 2217H-1 | Uncured SMT adhesive | Stencil and PCB test samples | Decotron® CP381 | Adhesive was removed; the report notes that some white stains remained. |
| DOW 4025TC, parts A and B | Two-part thermally conductive paste | Misprinted board test | Proton® 705 | Completely removed in the documented test; longer exposure changed the appearance of aluminum. |
| DowSil (Dow Corning) 4450 | Thermally conductive silicone adhesive | Printing stencil | Proton® 703 | Completely removed, including residue at sieve edges; labels required protection. |
100% RESPONSIBILITY FOR THE CLEANING PROCESS
We take full responsibility for the functionality of the cleaning process.
Complete cleaning solutions
We can offer complete cleaning solutions for all existing applications.
Quality of cleaning systems
We manufacture cleaning systems exclusively in stainless steel because it has long-term advantages.
pure quality of cleaning agents
We care about the functionality of the cleaning chemistry, but also about ecology.
Technical and economic improvements
With every project, our greatest motivation is to bring the customer a better technical and economic solution.
Development and customization
By continuously developing our cleaning technologies, we are moving forward and responding to developments in the electronics industry.
Democenters Worldwide
We give customers the opportunity to actually test the cleaning solution.
Direct service Support
For us, service support does not end with the installation, it begins.
Our references show the diversity of our customers and how we have been able to
to tailor our services to their needs and expectations.
