Providing reliable electronic components begins with absolute and verifiable cleanliness. DCT has been operating on the market for over 25 years, building a globally available network of local distributors and technical support. We offer a unique commitment to our clients: when you use a DCT cleaning system combined with our recommended cleaning fluid, we take 100% responsibility for your entire cleaning process.
The space underneath low-profile components, such as QFN or BGA packages, presents a significant defluxing challenge. Traditional horizontal systems often fail here due to the shadowing effect, where component bodies block the cleaning fluid from reaching adjacent areas. The InJet® series eliminates this issue through vertical Spray-in-Air technology. By holding the boards vertically and applying perpendicular high-pressure spray through rotating arms, InJet® machines break through shadow barriers, ensuring complete penetration under components with minimal stand-off heights.
Our fully automated, closed-loop systems operate in distinct configurations tailored for specific SMT applications:
| Contaminant / Trade Name | Contaminant Type | Application / Cleaned Part | Successfully Used DCT Fluid | Test Note |
|---|---|---|---|---|
| Alpha OM-338T | Solder Paste / Flux | PCBA | Decotron 411A | Successfully removed in DCT test |
| Indium 8.9HF SAC 387 | Solder Paste | PCBA | Decotron CP 381A+ | Successfully removed in DCT test |
| Alpha OM 340 | Solder Paste (BGA, LGA, QFN) | PCBA | Decotron 417XP | pH neutral, cleaned effectively under components |
| Indium SN62 NC-SMQ92J TYPE 3 | Solder Paste | PCBA | Decotron 417XP | Pre-cleaned with Decotron EFD1 prior to coating |
| Indium 8.9 HF/TYPE 4 | Solder Paste | PCBA | Decotron 417XP | Pre-cleaned with Decotron EFD1 prior to coating |
| SolderChemistry SCBLF 04 | Solder Paste | PCBA | Decotron 417XP | Successfully removed in DCT test |
| KOKI S3X58-M500C | Solder Paste | PCBA | Tested DCT Fluid | Exact fluid type not specified in report |
| ALPHA Fluitin 1532 | Solder Paste | PCBA | Tested DCT Fluid | Exact fluid type not specified in report |
| Stannol SP 2200 TSC | Solder Paste | PCBA | Proton 800 | Followed by mechanical removal and DI water rinse |
| Heraeus F620CU0.5-88M3 | Solder Paste | PCBA | Proton 800 | Followed by mechanical removal and DI water rinse |
| Pure Rosin ROL0 | Flux (Manual Soldering) | PCBA | Decotron 411A | Successfully removed in DCT test |
| Indium NC-SMQ 92H | Solder Paste (No-clean) | PCBA | Decotron 417XP | Successfully removed in DCT test |
| Senju SAC 305 | Solder Paste | PCBA | Decotron 417XP | Successfully removed in DCT test |
| Shenmao Nevo | Solder Paste | PCBA | Decotron 417XP | Successfully removed in DCT test |
| Koki HF1200 | Solder Paste | PCBA | Decotron 417XP | Successfully removed in DCT test |
| Ferro (silver pastes) | Metallization Paste | PCBA | Decotron 417XP | Successfully removed in DCT test |
| AIM M8 | Solder Paste | PCBA | Decotron CP381 (A) | Risk of solder mask whitening noted |
| Alpha CVP-390 | Solder Paste | PCBA | Decotron CP381 (A) | Successfully removed in DCT test |
| Almit LFM-48W | Solder Paste | PCBA | Decotron CP381 (A) | Successfully removed in DCT test |
| Koki SB6NX58 | Solder Paste | PCBA | Decotron CP381 (A) | Successfully removed in DCT test |
| Interflux IF2005M | Flux | PCBA | Decotron CP381 (A) | Successfully removed in DCT test |
| Alpha WB-700TF | Solder Paste | PCBA | Decotron 411 (A/B) | Low surface tension penetrates under components |
| Stannol SP 2200 | Solder Paste | PCBA | Decotron 411 (A/B) | Low surface tension penetrates under components |
| Heraeus F620CU0.5 | Solder Paste | PCBA | Decotron 411 (A/B) | Low surface tension penetrates under components |
| Heraeus F 620 | Solder Paste / Flux | PCBA | Decotron CP381 | Successfully removed in DCT test |
| Almit SR-38 RMA LFM-48-S 3.5 % | Solder Paste / Flux | PCBA | Decotron CP381 | Successfully removed in DCT test |
| Manual soldering residues | Flux | PCBA (local) | Flux Remover 4 | Highly volatile spray, requires no machine rinse |
100% RESPONSIBILITY FOR THE CLEANING PROCESS
We take full responsibility for the functionality of the cleaning process.
Complete cleaning solutions
We can offer complete cleaning solutions for all existing applications.
Quality of cleaning systems
We manufacture cleaning systems exclusively in stainless steel because it has long-term advantages.
pure quality of cleaning agents
We care about the functionality of the cleaning chemistry, but also about ecology.
Technical and economic improvements
With every project, our greatest motivation is to bring the customer a better technical and economic solution.
Development and customization
By continuously developing our cleaning technologies, we are moving forward and responding to developments in the electronics industry.
Democenters Worldwide
We give customers the opportunity to actually test the cleaning solution.
Direct service Support
For us, service support does not end with the installation, it begins.
Our references show the diversity of our customers and how we have been able to
to tailor our services to their needs and expectations.





